The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Feb. 19, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Durai Vishak Ramaswamy, Boise, ID (US);

Kirk D. Prall, Boise, ID (US);

Wayne Kinney, Emmett, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/51 (2006.01); H01L 21/28 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 45/00 (2006.01); G11C 14/00 (2006.01); H01L 27/108 (2006.01); H01L 27/1159 (2017.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/40 (2006.01); H01L 27/11585 (2017.01);
U.S. Cl.
CPC ...
H01L 29/516 (2013.01); G11C 14/0027 (2013.01); H01L 27/10823 (2013.01); H01L 27/1159 (2013.01); H01L 29/0847 (2013.01); H01L 29/1037 (2013.01); H01L 29/408 (2013.01); H01L 29/40111 (2019.08); H01L 29/4236 (2013.01); H01L 29/42364 (2013.01); H01L 29/42368 (2013.01); H01L 29/511 (2013.01); H01L 29/513 (2013.01); H01L 29/518 (2013.01); H01L 29/6684 (2013.01); H01L 29/78391 (2014.09); H01L 45/1206 (2013.01); H01L 45/1233 (2013.01); H01L 45/14 (2013.01); H01L 27/10876 (2013.01); H01L 27/11585 (2013.01);
Abstract

Some embodiments include a semiconductor construction having a gate extending into a semiconductor base. Conductively-doped source and drain regions are within the base adjacent the gate. A gate dielectric has a first segment between the source region and the gate, a second segment between the drain region and the gate, and a third segment between the first and second segments. At least a portion of the gate dielectric comprises ferroelectric material. In some embodiments the ferroelectric material is within each of the first, second and third segments. In some embodiments, the ferroelectric material is within the first segment or the third segment. In some embodiments, a transistor has a gate, a source region and a drain region; and has a channel region between the source and drain regions. The transistor has a gate dielectric which contains ferroelectric material between the source region and the gate.


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