The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Jun. 07, 2019
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Leonard P. Guler, Hillsboro, OR (US);

Chul-Hyun Lim, Albuquerque, NM (US);

Paul A. Nyhus, Portland, OR (US);

Elliot N. Tan, Portland, OR (US);

Charles H. Wallace, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 29/423 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76816 (2013.01); H01L 21/31144 (2013.01); H01L 21/76877 (2013.01); H01L 29/41725 (2013.01); H01L 29/42316 (2013.01);
Abstract

Embodiments disclosed herein include semiconductor devices and methods of forming such semiconductor devices. In an embodiment, a method of fabricating a semiconductor device comprises, forming a first grating of parallel first lines, forming a second grating of parallel second lines, wherein the second lines are substantially orthogonal to the first lines, and wherein the first lines and second lines define a plurality of first openings, disposing a conformal mask layer over the first lines and the second lines, wherein the conformal mask layer partially fills the first openings and defines a second opening within each of the first openings, disposing a hardmask over the conformal mask layer, wherein the hardmask fills the second openings, patterning third openings into the hardmask, wherein the third openings clear the hardmask from at least one of the second openings, and removing the mask layer proximate to cleared second openings to clear first openings.


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