The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Sep. 25, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Tanay Gosavi, Hillsboro, OR (US);

Sasikanth Manipatruni, Portland, OR (US);

Chia-Ching Lin, Portland, OR (US);

Dmitri Nikonov, Beaverton, OR (US);

Christopher Wiegand, Portland, OR (US);

Ian Young, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/16 (2006.01); G11C 11/18 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
G11C 11/1675 (2013.01); G11C 11/18 (2013.01); H01L 29/66984 (2013.01); G11C 11/1655 (2013.01); G11C 11/1657 (2013.01);
Abstract

An apparatus is provided which comprises: a magnetic junction having a magnet with perpendicular magnetic anisotropy (PMA) relative to an x-y plane of a device. In some embodiments, the apparatus comprises an interconnect partially adjacent to the structure of the magnetic junction, wherein the interconnect comprises a spin orbit material, wherein the interconnect has a pocket comprising non-spin orbit material, wherein the pocket is adjacent to the magnet of the magnetic junction. In some embodiments, the non-spin orbit material comprises metal which includes one or more of: Cu, Al, Ag, or Au.


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