The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Jul. 24, 2020
Applicants:

Egtm Co., Ltd., Suwon-si, KR;

SK Hynix Inc., Icheon-si, KR;

Inventors:

Geun Su Lee, Suwon-si, KR;

Jae Min Kim, Bucheon-si, KR;

Ha Na Kim, Suwon-si, KR;

Woong Jin Choi, Suwon-si, KR;

Eun Ae Jung, Hwaseong-si, KR;

Dong Hyun Lee, Yongin-si, KR;

Myung Soo Lee, Seoul, KR;

Ji Won Moon, Yongin-si, KR;

Dong Hak Jang, Suwon-si, KR;

Hyun Sik Noh, Suwon-si, KR;

Assignees:

EGTM CO., LTD., Suwon-si, KR;

SK HYNIX INC., Icheon-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/02 (2006.01); C23C 16/06 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45534 (2013.01); C23C 16/0272 (2013.01); C23C 16/06 (2013.01); C23C 16/45553 (2013.01); C23C 16/45561 (2013.01);
Abstract

Disclosed is a method of forming a thin film using a surface protection material, the method comprising supplying the surface protection material to the inside of a chamber on which a substrate is placed so that the surface protection material is adsorbed to the substrate, discharging the unadsorbed surface protection material from the inside of the chamber by purging the interior of the chamber, supplying a metal precursor to the inside of the chamber so that the metal precursor is adsorbed to the substrate, discharging the unadsorbed metal precursor from the inside of the chamber by purging the interior of the chamber, and supplying a reaction material to the inside of the chamber so that the reaction material reacts with the adsorbed metal precursor to form the thin film.


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