The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Nov. 10, 2021
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Thomas H. Kinsley, Boise, ID (US);
George E. Pax, Boise, ID (US);
Yogesh Sharma, Boise, ID (US);
Gregory A. King, Hastings, MN (US);
Chan H. Yoo, Boise, ID (US);
Randon K. Richards, Kuna, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); G06F 1/20 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); G06F 1/20 (2013.01); H01L 23/3672 (2013.01); H01L 23/373 (2013.01); H01L 23/467 (2013.01); H05K 7/20436 (2013.01); G06F 2200/201 (2013.01);
Abstract
Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. An apparatus may have a printed circuit board (PCB) having an edge connector. At least one integrated circuit device may be disposed on a surface of the PCB. A tubular heat spreader may be disposed along an edge of the PCB opposite the edge connector.