The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Oct. 27, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yu-Hsiang Tsai, Hsinchu, TW;

Chung-Chuan Tseng, Hsinchu, TW;

Chia-Ping Lai, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 28/91 (2013.01); H01L 21/308 (2013.01);
Abstract

A semiconductor structure includes a substrate having a trench array therein, wherein the trench array includes a plurality of outer trenches and a plurality of inner trenches, wherein each of the plurality of outer trenches has a width greater than a width of each of the plurality of inner trenches. The semiconductor structure further includes a capacitor material stack extending into the trench array.


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