The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2023
Filed:
Aug. 21, 2019
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Rohit Kothari, Boise, ID (US);
Harsh Narendrakumar Jain, Boise, ID (US);
John D. Hopkins, Meridian, ID (US);
Xiaosong Zhang, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 2223/5446 (2013.01); H01L 2223/54426 (2013.01);
Abstract
An electronic device comprising at least one high aspect ratio feature in a base stack of materials, overlay marks in or on only an upper portion of the base stack of materials, and an additional stack of materials adjacent the base stack of materials, the additional stack of materials comprising the at least one high aspect ratio feature. Additional electronic devices and memory devices are disclosed, as are methods of forming high aspect ratio features in an electronic device.