The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Nov. 10, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Aniket Patil, San Diego, CA (US);

Zhijie Wang, San Diego, CA (US);

Joan Rey Villarba Buot, Escondido, CA (US);

Hong Bok We, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/495 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/49558 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 2225/107 (2013.01);
Abstract

A device comprising a first package and a second package coupled to the first package. The first package includes a first substrate, at least one gradient interconnect structure coupled to the first substrate, and a first integrated device coupled to the first substrate. The second package includes a second substrate and a second integrated device coupled to the second substrate. The second substrate is coupled to the at least one gradient interconnect structure.


Find Patent Forward Citations

Quick Actions:

Patil, Aniket. (2023). Package comprising inter-substrate gradient interconnect structure (U.S. Patent No. 11581251). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11581251

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