The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2023
Filed:
Oct. 31, 2019
Applicant:
Lam Research Corporation, Fremont, CA (US);
Inventors:
Peter S. Thaulad, San Jose, CA (US);
Brett M. Herzig, San Jose, CA (US);
Richard M. Blank, San Jose, CA (US);
Benjamin Wayne Mooring, Austin, TX (US);
Assignee:
Lam Research Corporation, Fremont, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/687 (2006.01); H01L 21/68 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68707 (2013.01); H01L 21/67265 (2013.01); H01L 21/67706 (2013.01); H01L 21/67766 (2013.01); H01L 21/67778 (2013.01); H01L 21/67781 (2013.01); H01L 21/68 (2013.01); H01L 21/681 (2013.01); H01L 21/68785 (2013.01);
Abstract
Systems and techniques for determining and correcting inter-wafer misalignments in a stack of wafers transported by a wafer handling robot. An enhanced automatic wafer centering system is provided that may be used to determine a smallest circle associated with the stack of wafers, which may then be used to determine whether or not the stack of wafer meets various process requirements and/or if a centering correction can be made to better align the wafers with a receiving station coordinate frame.