The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

Aug. 17, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Tadashi Iino, Kumamoto, JP;

Yoshihiro Kai, Kumamoto, JP;

Yoichi Tokunaga, Kumamoto, JP;

Nobuhiro Ogata, Kumamoto, JP;

Jiro Higashijima, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); H01L 21/304 (2013.01); H01L 21/306 (2013.01); H01L 21/6708 (2013.01); H01L 21/67051 (2013.01); H01L 21/68764 (2013.01);
Abstract

A substrate processing apparatus includes: a processing unit including a holder that holds a substrate and rotates the substrate, a nozzle that ejects a processing liquid, and a conductive piping unit that supplies the processing liquid to the nozzle; a controller that causes the processing unit to execute a liquid processing in which the substrate is processed by supplying the processing liquid from the nozzle to the substrate that is held and rotated by the holder, and a measuring unit that measures a flowing current generated by the processing liquid flowing through the piping unit. The controller monitors the liquid processing based on a measurement result by the measuring unit.


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