The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

Mar. 05, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Yen-Hung Lin, Hsinchu, TW;

Chung-Hsing Wang, Hsinchu County, TW;

Yuan-Te Hou, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 9/455 (2018.01); G06F 30/392 (2020.01); G06F 30/398 (2020.01);
U.S. Cl.
CPC ...
G06F 30/392 (2020.01); G06F 30/398 (2020.01);
Abstract

A method includes: accessing a design data of an integrated circuit (IC), wherein the design data includes a transistor layer and a plurality of metal layers over the transistor layer; assigning a bin size for each of the metal layers based on layout properties of the respective metal layers, wherein a bin size of a higher larger of the metal layers has a greater bin size than that of a lower layer of the metal layers; performing resource planning on the transistor layer and each of the metal layers according to the assigned bin sizes of the respective metal layers; and updating the design data according to the resource planning. At least one of the accessing, assigning, performing and updating steps is conducted by at least one processor.


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