The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2023
Filed:
Mar. 29, 2019
Mitsubishi Materials Corporation, Tokyo, JP;
Fuyumi Mawatari, Aizuwakamatsu, JP;
Kazunari Maki, Aizuwakamatsu, JP;
Shinichi Funaki, Aizuwakamatsu, JP;
Yuki Inoue, Naka, JP;
Kiyotaka Nakaya, Naka, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A tin-plated copper terminal material in which on a substrate made of copper or copper alloy, a nickel-or-nickel-alloy layer, a copper-tin alloy layer, and a tin layer are laminated in this order; in this material, the tin layer has an average thickness 0.2 μm to 1.2 μm inclusive; the copper-tin alloy layer is a compound alloy layer in which CuSnis a main ingredient and part of copper in the CuSnis substituted with nickel, and an average crystal grain size is 0.2 μm to 1.5 μm inclusive; part of the copper-tin alloy layer appears on a surface of the tin layer and tin solidification parts exist like islands; and the tin solidification parts have an average diameter 10 μm to 1000 μm inclusive in a direction along the surface of the tin layer and an area ratio to the surface of the tin layer 1% to 90% inclusive.