The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Feb. 22, 2022
Global Unichip Corporation, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Yu-Ju Chang, Hsinchu, TW;
Ding-Kang Shen, Hsinchu, TW;
Yun-Jia Li, Hsinchu, TW;
Jia-Liang Chen, Hsinchu, TW;
GLOBAL UNICHIP CORPORATION, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A circuit board device includes a multilayer structure, a main ground area and a circuit module. The multilayer structure includes a plurality of plates. The main ground area is arranged in the multilayer structure. The circuit module includes a differential signal circuit and a surrounding circuit module. The differential signal circuit is located in the multilayer structure, and includes a positive signal pad and a negative signal pad. The positive signal pad is located on a configuration surface of one of the plates. The negative signal pad is located on the disposition surface, and is separated from the positive signal pad. The surrounding circuit module is located on the disposition surface, and electrically connected to the main ground area. The surrounding circuit module surrounds the positive signal pad and the negative signal pad in an enclosing way, and is physically separated from the differential signal circuit.