The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Jul. 21, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Harry-Hak-Lay Chuang, Hsinchu County, TW;

Sheng-Huang Huang, Hsinchu, TW;

Hung-Cho Wang, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/12 (2006.01); H01L 43/02 (2006.01); H01L 27/22 (2006.01);
U.S. Cl.
CPC ...
H01L 43/12 (2013.01); H01L 27/222 (2013.01); H01L 43/02 (2013.01);
Abstract

A method for fabricating the semiconductor device is provided. The method includes depositing a first dielectric layer; forming a first memory cell over the first dielectric layer; depositing a second dielectric layer over the first memory cell; and forming a second memory cell over the second dielectric layer. Forming the first memory cell includes depositing a first resistance switching layer over the first dielectric layer and performing a first physical etching process to pattern the first resistance switching layer into a first resistance switching element. Forming the second memory cell includes depositing a second resistance switching layer over the second dielectric layer and performing a chemical etching process to pattern the second resistance switching layer into a second resistance switching element.


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