The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
May. 24, 2018
Shinkawa Ltd., Tokyo, JP;
Tohoku University, Miyagi, JP;
Yuji Eguchi, Tokyo, JP;
Kohei Seyama, Tokyo, JP;
Tomonori Nakamura, Tokyo, JP;
Hiroshi Kikuchi, Tokyo, JP;
Takehito Shimatsu, Miyagi, JP;
Miyuki Uomoto, Miyagi, JP;
SHINKAWA LTD., Tokyo, JP;
TOHOKU UNIVERSITY, Miyagi, JP;
Abstract
This method for producing a structure wherein base materials are bonded by atomic diffusion comprises: a step for applying a liquid resin on the base material; a step for smoothing the surface of the liquid resin by surface tension; a step for forming a resin layer by curing; a step for forming a metal thin film on the resin layer; a step for forming a metal thin film on the base material; and a step for bringing the metal thin film of the base material and the metal thin film of the base material into close contact with each other, thereby bonding the metal thin film of the resin layer and the metal thin film of the base material with each other by atomic diffusion.