The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Dec. 16, 2020
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Te-Hsin Chiu, Hsinchu, TW;
Wei-An Lai, Hsinchu, TW;
Meng-Hung Shen, Hsinchu, TW;
Wei-Cheng Lin, Hsinchu, TW;
Jiann-Tyng Tzeng, Hsinchu, TW;
Kam-Tou Sio, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/76802 (2013.01); H01L 21/76831 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01);
Abstract
The present disclosure provides a semiconductor structure, including a substrate, a first metal line over the substrate and extending along a first direction, a protection layer lining a sidewall of the first metal line, a second metal line above the first metal line and extending along the first direction, and a third metal line above the second metal line, extending along a second direction perpendicular to the first direction.