The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Aug. 13, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Scott Halle, Slingerlands, NY (US);

Kyong Min Yeo, Scarsdale, NY (US);

Robin Hsin Kuo Chao, Cohoes, NY (US);

Derren Dunn, Sandy Hook, CT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/20 (2020.01); G06F 17/16 (2006.01); G06F 17/18 (2006.01); G06F 30/392 (2020.01);
U.S. Cl.
CPC ...
G06F 30/20 (2020.01); G06F 17/16 (2013.01); G06F 17/18 (2013.01); G06F 30/392 (2020.01);
Abstract

Predictive multi-stage modelling for complex semiconductor device manufacturing process control is provided. In one aspect, a method of predictive multi-stage modelling for controlling a complex semiconductor device manufacturing process includes: collecting geometrical data from metrology measurements made at select stages of the manufacturing process; and making an outcome probability prediction at each of the select stages using a multiplicative kernel Gaussian process, wherein the outcome probability prediction is a function of a current stage and all prior stages. Machine-learning models can be trained for each of the select stages of the manufacturing process using the multiplicative kernel Gaussian process. The machine-learning models can be used to provide probabilistic predictions for a final outcome in real-time for production wafers. The probabilistic predictions can then be used to select production wafers for rework, sort, scrap or disposition.


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