The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2023
Filed:
Jan. 19, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Yi-Yun Li, Hsinchu, TW;
Tsai-Yu Huang, Taoyuan, TW;
Huicheng Chang, Tainan, TW;
Yee-Chia Yeo, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method for forming a semiconductor structure is provided. The method includes forming a fin structure over a substrate and forming an isolation structure over the substrate. In addition, the fin structure is protruded from the isolation structure. The method further includes trimming the fin structure to a first width and forming a Ge-containing material covering the fin structure. The method further includes annealing the fin structure and the Ge-containing material to form a modified fin structure. The method also includes trimming the modified fin structure to a second width.