The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2023

Filed:

Oct. 07, 2020
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Koichi Yatsuda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 21/28 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/768 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
H01L 29/6681 (2013.01); H01L 21/28158 (2013.01); H01L 21/3086 (2013.01); H01L 21/76897 (2013.01); H01L 29/511 (2013.01); H01L 29/517 (2013.01); H01L 29/518 (2013.01); H01L 29/78 (2013.01); H01L 29/7851 (2013.01);
Abstract

A method for manufacturing a semiconductor device includes: a first insulating film forming step of forming a first insulating film in a transistor having a structure in which a source and a drain raised in a fin shape are covered with a gate; a sacrifice film forming step of forming a sacrifice film; a hard mask pattern forming step of forming a hard mask film having a desired pattern; a first opening forming step of forming a first opening; a second insulating film forming step of forming a second insulating film made of a material different from the first insulating film, in the first opening; a second opening forming step of forming a second opening by removing the sacrifice film, after the second insulating film forming step; and a contact plug forming step of forming a contact plug in the second opening.


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