The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2023
Filed:
Apr. 13, 2021
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
ChunHung Chen, Hsinchu, TW;
Sheng-Chen Wang, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); B24B 37/34 (2012.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); B24B 37/34 (2013.01); B32B 7/12 (2013.01); B32B 37/12 (2013.01); B32B 2307/538 (2013.01); Y10T 156/1168 (2015.01); Y10T 156/1978 (2015.01); Y10T 156/1989 (2015.01);
Abstract
A pad removal method includes affixing a first end of a pad guide to a first edge location of a pad. The pad removal method further includes affixing a second end of the pad guide to a second edge location of the pad. The pad removal method further includes moving the first end from a first position, a first distance from the second edge location, to a second position, a second distance from the second edge location, wherein the first distance is greater than a diameter of the pad, and the second distance is less than the diameter of the pad.