The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2023
Filed:
Jun. 25, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Chandrashekara Shashank Kaira, Chandler, AZ (US);
Phillip C. Miller, Chandler, AZ (US);
Purushotham Kaushik Muthur Srinath, Chandler, AZ (US);
Deepak Goyal, Phoenix, AZ (US);
Assignee:
INTEL CORPORATION, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G01J 5/00 (2022.01);
U.S. Cl.
CPC ...
H01L 21/67288 (2013.01); G01J 5/0007 (2013.01); H01L 21/67248 (2013.01);
Abstract
According to the various examples, a fully integrated system and method for failure analysis using RF-based thermometry enable the detection and location of defects and failures in complex semiconductor packaging architectures. The system provides synchronous amplified RF signals to generate unique thermal signatures at defect locations based on dielectric relaxation loss and heating.