The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2023

Filed:

Mar. 19, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Yaoling Pan, Santa Clara, CA (US);

Vijaykumar Krithivasan, San Jose, CA (US);

Shimin Mao, Santa Clara, CA (US);

Kelvin Chan, San Ramon, CA (US);

Michael D. Willwerth, Campbell, CA (US);

Anantha Subramani, Santa Clara, CA (US);

Ashish Goel, Sunnyvale, CA (US);

Chih-shun Lu, Los Altos, CA (US);

Philip Allan Kraus, San Jose, CA (US);

Patrick John Tae, Palo Alto, CA (US);

Leonard Tedeschi, San Jose, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/244 (2006.01); H01L 21/67 (2006.01); H01L 41/047 (2006.01); H01L 41/053 (2006.01); H01L 41/29 (2013.01); H01L 41/04 (2006.01); H01J 37/32 (2006.01); H01L 41/31 (2013.01);
U.S. Cl.
CPC ...
H01J 37/244 (2013.01); H01J 37/32917 (2013.01); H01L 21/67253 (2013.01); H01L 41/044 (2013.01); H01L 41/0475 (2013.01); H01L 41/0533 (2013.01); H01L 41/0536 (2013.01); H01L 41/29 (2013.01); H01L 41/31 (2013.01); H01J 37/32642 (2013.01); H01J 2237/24592 (2013.01);
Abstract

Embodiments described herein include a resonant process monitor and methods of forming such a resonant process monitor. In an embodiment, the resonant process monitor includes a frame that has a first opening and a second opening. In an embodiment, a resonant body seals the first opening of the frame. In an embodiment, a first electrode on a first surface of the resonant body contacts the frame and a second electrode is on a second surface of the resonant body. Embodiments also include a back plate that seals the second opening of the frame. In an embodiment the back plate is mechanically coupled to the frame, and the resonant body, the back plate, and interior surfaces of the frame define a cavity.


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