The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Jan. 08, 2020
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Pinghui Li, Singapore, SG;

Handoko Linewih, Singapore, SG;

Darin Arthur Chan, Santa Clara, CA (US);

Ruchil Kumar Jain, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7824 (2013.01); H01L 29/66681 (2013.01);
Abstract

The present disclosure generally to semiconductor devices, and more particularly to semiconductor devices having high-voltage transistors integrated on a semiconductor-on-insulator substrate and methods of forming the same. The present disclosure provides a semiconductor device including a semiconductor-on-insulator (SOI) substrate having a semiconductor layer, a bulk substrate and an insulating layer between the semiconductor layer and the bulk substrate, a source region and a drain region disposed on the bulk substrate, an isolation structure extending through the insulating layer and the semiconductor layer and terminates in the bulk substrate, and a gate structure between the source region and the drain region, the gate structure is disposed on the semiconductor layer.


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