The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Jun. 05, 2020
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Assignee:
QUALCOMM INCORPORATED, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 23/49805 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 25/0657 (2013.01);
Abstract
Some features pertain to a substrate that includes a first portion of the substrate including a first plurality of metal layers, a second portion of the substrate including a second plurality of metal layers, and a plurality of insulating layers configured to separate the first plurality of metal layers and the second plurality of metal layers. A first plurality of posts and a plurality of interconnects are coupled together such that the first plurality of posts and the plurality of interconnects couple the first portion of the substrate to the second portion of the substrate.