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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11545355 B1

PDFFull Text
Date of Patent:
Jan. 03, 2023

Filed:

Nov. 13, 2020

Substrate processing method and substrate processing apparatus

Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kae Kumagai, Miyagi, JP;

Toru Hisamatsu, Hillsboro, OR (US);

Masanobu Honda, Miyagi, JP;

Assignee:

TOKYO ELECTRON LIMITED, Tokyo, JP;

Attorney:

Weihrouch IP

Primary Examiner:

Asok K Sarkar

Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/66 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0228 (2013.01); C23C 16/45527 (2013.01); C23C 16/45544 (2013.01); C23C 16/52 (2013.01); H01J 37/32449 (2013.01); H01L 21/02274 (2013.01); H01L 21/308 (2013.01); H01L 21/3065 (2013.01); H01L 22/26 (2013.01); H01J 2237/3321 (2013.01);
Abstract

A method for processing a substrate includes: (a) exposing a substrate with a pattern formed on a surface thereof to a first reactive species in a chamber, thereby adsorbing the first reactive species onto the surface of the substrate; (b) exposing the substrate to plasma formed by a second reactive species in the chamber, thereby forming a film on the surface of the substrate; and (c) repeating a processing including (a) and (b) two or more times while changing a residence amount of the first reactive species at a time of starting (b).

Find Patent Forward Citations

Kumagai, Kae. (2023). Substrate processing method and substrate processing apparatus (U.S. Patent No. 11545355). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11545355

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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