The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2023
Filed:
Oct. 14, 2020
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Michael Sheperek, Longmont, CO (US);
Bruce A. Liikanen, Berthoud, CO (US);
Steve Kientz, Westminster, CO (US);
Anita Ekren, Loveland, CO (US);
Gerald Cadloni, Longmont, CO (US);
Assignee:
MICRON TECHNOLOGY, INC., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/34 (2006.01); G11C 16/10 (2006.01); G11C 7/04 (2006.01); G11C 16/32 (2006.01); G11C 16/30 (2006.01); G11C 16/26 (2006.01);
U.S. Cl.
CPC ...
G11C 16/349 (2013.01); G11C 7/04 (2013.01); G11C 16/10 (2013.01); G11C 16/26 (2013.01); G11C 16/30 (2013.01); G11C 16/32 (2013.01); G11C 16/3404 (2013.01); G11C 16/3459 (2013.01);
Abstract
A measure associated with a characteristic of a die of a memory device is obtained. It is determined whether the measure satisfies a first criterion to group one or more die into a first die family. If it is determined that the measure satisfies the first criterion, the die is associated with the first die family.