The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Jul. 30, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chen-Hsuan Liao, Hsinchu, TW;

Chih-Chung Chang, Nantou County, TW;

Chun-Heng Chen, Hsinchu, TW;

Jiun-Ming Kuo, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/28 (2006.01); H01L 21/8234 (2006.01); H01L 29/51 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42368 (2013.01); H01L 21/28185 (2013.01); H01L 21/28194 (2013.01); H01L 21/823462 (2013.01); H01L 29/6681 (2013.01); H01L 29/66795 (2013.01); H01L 29/7843 (2013.01); H01L 29/7851 (2013.01); H01L 29/7854 (2013.01); H01L 29/7856 (2013.01); H01L 27/0886 (2013.01); H01L 29/513 (2013.01);
Abstract

A semiconductor device includes a substrate, a plurality of insulators, a liner structure and a gate stack. The substrate has fins and trenches in between the fins. The insulators are disposed within the trenches of the substrate. The liner structure is disposed on the plurality of insulators and across the fins, wherein the liner structure comprises sidewall portions and a cap portion, the sidewall portions is covering sidewalls of the fins, the cap portion is covering a top surface of the fins and joined with the sidewall portions, and a maximum thickness Tof the cap portion is greater than a thickness Tof the sidewall portions. The gate stack is disposed on the liner structure and across the fins.


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