The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2022

Filed:

Jun. 24, 2020
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Chin-Shen Lin, Taipei, TW;

Wan-Yu Lo, Taoyuan County, TW;

Meng-Xiang Lee, Yunlin County, TW;

Hao-Tien Kan, Hsinchu, TW;

Kuo-Nan Yang, Hsinchu, TW;

Chung-Hsing Wang, Hsinchu County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H05K 1/0298 (2013.01);
Abstract

The present disclosure provides a routing structure. The routing structure includes a substrate having a first circuit region and a boundary surrounding the first circuit region. The routing structure also includes a first conductive trace coupled to a first conductive pad disposed in the first circuit region. The first conductive trace is inclined with respect to the boundary of the substrate. A method of forming a routing structure is also disclosed.


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