The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Oct. 12, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Fang Chen, Hsinchu, TW;

Jhon Jhy Liaw, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/45 (2006.01); H01L 29/40 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 27/088 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 27/092 (2006.01); H01L 29/423 (2006.01); H01L 29/165 (2006.01); H01L 29/49 (2006.01); H01L 29/51 (2006.01); H01L 23/532 (2006.01); H01L 21/321 (2006.01); H01L 21/8234 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01); H01L 21/8238 (2006.01); H01L 21/3105 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 29/785 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01); H01L 21/76224 (2013.01); H01L 21/76816 (2013.01); H01L 21/76843 (2013.01); H01L 21/76852 (2013.01); H01L 21/76895 (2013.01); H01L 21/823431 (2013.01); H01L 21/823475 (2013.01); H01L 21/823481 (2013.01); H01L 21/823871 (2013.01); H01L 21/823878 (2013.01); H01L 23/528 (2013.01); H01L 23/5221 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 27/0886 (2013.01); H01L 27/0924 (2013.01); H01L 29/401 (2013.01); H01L 29/41791 (2013.01); H01L 29/456 (2013.01); H01L 29/6656 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01); H01L 21/31053 (2013.01); H01L 21/31111 (2013.01); H01L 21/76819 (2013.01); H01L 21/76871 (2013.01); H01L 23/53214 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01); H01L 23/53266 (2013.01); H01L 29/165 (2013.01); H01L 29/42364 (2013.01); H01L 29/45 (2013.01); H01L 29/4966 (2013.01); H01L 29/513 (2013.01); H01L 29/517 (2013.01); H01L 29/518 (2013.01); H01L 29/665 (2013.01); H01L 29/66636 (2013.01); H01L 29/7848 (2013.01); H01L 2029/7858 (2013.01);
Abstract

The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure includes a first active region and a second fin active region extruded from a semiconductor substrate; an isolation featured formed in the semiconductor substrate and being interposed between the first and second fin active regions; a dielectric gate disposed on the isolation feature; a first gate stack disposed on the first fin active region and a second gate stack disposed on the second fin active region; a first source/drain feature formed in the first fin active region and interposed between the first gate stack and the dielectric gate; a second source/drain feature formed in the second fin active region and interposed between the second gate stack and the dielectric gate; a contact feature formed in a first inter-level dielectric material layer and landing on the first and second source/drain features and extending over the dielectric gate.


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