The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Jun. 29, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Michael J. Hill, Gilbert, AZ (US);

Mathew Manusharow, Phoenix, AZ (US);

Beomseok Choi, Chandler, AZ (US);

Digvijay Raorane, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/16 (2006.01); H01L 23/00 (2006.01); H01L 23/64 (2006.01); G06F 1/28 (2006.01); H01F 27/28 (2006.01); H01F 38/14 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); G06F 1/28 (2013.01); H01F 27/28 (2013.01); H01F 38/14 (2013.01); H01L 23/16 (2013.01); H01L 23/645 (2013.01); H01L 25/18 (2013.01); H01L 23/00 (2013.01);
Abstract

An apparatus includes a substrate, one or more integrated circuit dies on the substrate, and a stiffener affixed to the substrate. One or more sections of the stiffener may includes a magnetic material. The apparatus further includes an inductive circuit element comprising one or more conductive structures wrapped around the magnetic material. In some examples where a first coil is wrapped around a first section of the stiffener, and a second coil is wrapped around a second section of the stiffener, current supplied to the first coil generates at the second coil a current that is further transmitted to the one or more semiconductor dies.


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