The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2022
Filed:
Jun. 29, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Chong Zhang, Chandler, AZ (US);
Krishna Bharath, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/13 (2006.01); H01L 51/10 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01F 27/28 (2006.01); H01L 21/48 (2006.01); H01L 51/00 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01F 27/2804 (2013.01); H01L 21/4846 (2013.01); H01L 23/13 (2013.01); H01L 23/367 (2013.01); H01L 23/3736 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/16 (2013.01); H01L 51/0004 (2013.01); H01L 51/0026 (2013.01); H01L 51/0096 (2013.01); H01L 51/10 (2013.01); H01F 2027/2809 (2013.01); H01L 29/7869 (2013.01); H01L 51/0048 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/1307 (2013.01); H01L 2924/13061 (2013.01); H01L 2924/13069 (2013.01); H01L 2924/1427 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19102 (2013.01);
Abstract
Embodiments herein relate to integrating FIVR switching circuitry into a substrate that has a first side and a second side opposite the first side, where the first side of the substrate to electrically couple with a die and to provide voltage to the die and the second side of the substrate is to couple with an input voltage source. In embodiments, the FIVR switching circuitry may be printed onto the substrate using OFET, CNT, or other transistor technology, or may be included in a separate die that is incorporated within the substrate.