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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11524386 B1

PDFFull Text
Date of Patent:
Dec. 13, 2022

Filed:

Mar. 25, 2020

Grinding apparatus

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Souichi Matsubara, Tokyo, JP;

Tetsuo Kubo, Tokyo, JP;

Shinji Yamashita, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain, Ltd.

Primary Examiner:

Joel D Crandall

Assistant Examiner:

Makena S Markman

Int. Cl.
CPC ...
B24B 49/04 (2006.01); B24B 41/00 (2006.01); B24B 5/50 (2006.01); B24B 7/22 (2006.01); H01L 21/304 (2006.01); B24B 49/02 (2006.01);
U.S. Cl.
CPC ...
B24B 49/04 (2013.01); B24B 5/50 (2013.01); B24B 7/228 (2013.01); B24B 41/005 (2013.01); B24B 49/02 (2013.01); H01L 21/304 (2013.01);
Abstract

A grinding apparatus including a chuck table for holding a wafer, a grinding unit having a spindle for rotating a grinding wheel, an inclination adjusting unit for adjusting the inclination of the rotation axis of the chuck table with respect to the rotation axis of the spindle, a touch panel, and a control portion. The control portion is adapted to compare the information regarding the target sectional shape input into a target shape input field with the information regarding the present sectional shape input into a present shape input field and then control the inclination adjusting unit to change the inclination of the rotation axis of the chuck table so that the wafer is ground to obtain the target sectional shape of the wafer.

Find Patent Forward Citations

Matsubara, Souichi. (2022). Grinding apparatus (U.S. Patent No. 11524386). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11524386

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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