The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Mar. 18, 2019
Mattson Technology, Inc., Fremont, CA (US);
Beijing E-town Semiconductor Technology Co., Ltd., Beijing, CN;
Rolf Bremensdorfer, Bibertal, DE;
Johannes Keppler, Palo Alto, CA (US);
Michael X. Yang, Palo Alto, CA (US);
Thorsten Hülsmann, Dornstadt, DE;
BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD, Beijing, CN;
MATTSON TECHNOLOGY, INC., Fremont, CA (US);
Abstract
Support plates for localized heating in thermal processing systems to uniformly heat workpieces are provided. In one example implementation, localized heating is achieved by modifying a heat transmittance of a support plate such that one or more portions of the support plate proximate the areas that cause cold spots transmit more heat than the rest of the support plate. For example, the one or more portions (e.g., areas proximate to one or more support pins) of the support plate have a higher heat transmittance (e.g., a higher optical transmission) than the rest of the support plate. In another example implementation, localized heating is achieved by heating a workpiece via a coherent light source through a transmissive support structure (e.g., one or more support pins, or a ring support) in addition to heating the workpiece globally by light from heat sources.