The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Jun. 29, 2020
Tokyo Electron Limited, Tokyo, JP;
Kazutoshi Iwai, Koshi, JP;
Nobutaka Mizutani, Tokyo, JP;
Yuichiro Inatomi, Koshi, JP;
Takashi Tanaka, Koshi, JP;
TOKYO ELECTRON LIMITED, Tokyo, JP;
Abstract
A plating apparatus, a plating method and a recording medium can allow a temperature of a wafer to be uniform within a surface thereof. A plating apparatusincludes a substrate holding unitconfigured to hold a substrate W; a plating liquid supply unitconfigured to supply a plating liquid Mto the substrate W; and a solvent supply unitconfigured to supply a solvent Nhaving a different temperature from a temperature of the plating liquid Mto the substrate W. The solvent Nis supplied to a preset position on the substrate W from the solvent supply unitafter the plating liquid Mis supplied to the substrate W from the plating liquid supply unit