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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11518911 B1

PDFFull Text
Date of Patent:
Dec. 06, 2022

Filed:

Feb. 28, 2019

Polishing composition, manufacturing method of polishing composition, polishing method, and manufacturing method of semiconductor substrate

Applicant:

Fujimi Incorporated, Aichi, JP;

Inventors:

Yukinobu Yoshizaki, Aichi, JP;

Yohei Takahashi, Aichi, JP;

Yohei Nakata, Aichi, JP;

Assignee:

FUJIMI INCORPORATED;

Attorney:

Katten Munchin Roseman LLP

Primary Examiner:

Jiong-Ping Lu

Int. Cl.
CPC ...
C09G 1/02 (2006.01); B24B 37/04 (2012.01); C09K 3/14 (2006.01); B24B 37/00 (2012.01); H01L 21/306 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/00 (2013.01); B24B 37/044 (2013.01); C09K 3/1409 (2013.01); C09K 3/1436 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); H01L 21/30625 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01); H01L 21/76819 (2013.01);
Abstract

The present invention provides, in polishing an object to be polished that contains an (a) material having silicon-nitrogen bonding and (b) other materials, means that is capable of improving a ratio of a polishing speed of the (a) material to a polishing speed of the (b) materials. The present invention relates to a polishing composition used for polishing an object to be polished that contains an (a) material having silicon-nitrogen bonding and (b) other materials, the polishing composition containing: organic acid-immobilized silica; a dispersing medium; a selection ratio improver that improves a ratio of a polishing speed of the (a) material to a polishing speed of the (b) materials; and an acid, in which the selection ratio improver is organopolysiloxane having a hydrophilic group.

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Yoshizaki, Yukinobu. (2022). Polishing composition, manufacturing method of polishing composition, polishing method, and manufacturing method of semiconductor substrate (U.S. Patent No. 11518911). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11518911

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