The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

Oct. 07, 2020
Applicant:

Innoscience (Zhuhai) Technology Co., Ltd., Zhuhai, CN;

Inventors:

Hang Liao, Zhuhai, CN;

Qiyue Zhao, Zhuhai, CN;

Chang An Li, Zhuhai, CN;

Chao Wang, Zhuhai, CN;

Chunhua Zhou, Zhuhai, CN;

King Yuen Wong, Zhuhai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/778 (2006.01); H01L 29/20 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7787 (2013.01); H01L 29/0619 (2013.01); H01L 29/2003 (2013.01); H01L 29/404 (2013.01);
Abstract

The present invention relates to a semiconductor device with an asymmetric gate structure. The device comprises a substrate; a channel layer, positioned above the substrate; a barrier layer, positioned above the channel layer, the barrier layer and the channel layer being configured to form two-dimensional electron gas (2DEG), and the 2DEG being formed in the channel layer along an interface between the channel layer and the barrier layer; a source contact and a drain contact, positioned above the barrier layer; a doped group III-V layer, positioned above the barrier layer and between the drain contact and the source contact; and a gate electrode, positioned above the doped group III-V layer and configured to form a Schottky junction with the doped group III-V layer, wherein the doped group III-V layer and/or gate electrode has a non-central symmetrical geometry so as to achieve the effect of improving gate leakage current characteristics.


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