The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2022

Filed:

Dec. 04, 2020
Applicant:

Imec Vzw, Leuven, BE;

Inventors:

Eugenio Dentoni Litta, Leuven, BE;

Juergen Boemmels, Heverlee, BE;

Julien Ryckaert, Schaerbeek, BE;

Naoto Horiguchi, Leuven, BE;

Pieter Weckx, Bunsbeek, BE;

Assignee:

IMEC vzw, Leuven, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 29/417 (2006.01); H01L 29/786 (2006.01); H01L 23/528 (2006.01); H01L 21/02 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66515 (2013.01); H01L 21/02603 (2013.01); H01L 21/823807 (2013.01); H01L 21/823871 (2013.01); H01L 23/5286 (2013.01); H01L 27/092 (2013.01); H01L 29/0673 (2013.01); H01L 29/41733 (2013.01); H01L 29/42392 (2013.01); H01L 29/66742 (2013.01); H01L 29/78696 (2013.01);
Abstract

In one aspect, a method of forming a semiconductor device can comprise forming a first transistor structure and a second transistor structure separated by a first trench which comprises a first dielectric wall protruding above a top surface of the transistor structures. The first and the second transistor structures each can comprise a plurality of stacked nanosheets forming a channel structure, and a source portion and a drain portion horizontally separated by the channel structure. The method further can comprise depositing a contact material over the transistor structures and the first dielectric wall, thereby filling the first trench and contacting a first source/drain portion of the first transistor structure and a first source/drain portion of the second transistor structure. Further, the method can comprise etching back the contact material layer below a top surface of the first dielectric wall, thereby forming a first contact contacting the first source/drain portion of the first transistor structure, and a second contact contacting the first source/drain portion of the second transistor structure.


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