The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Dec. 26, 2018
Applicant:

Sj Semiconductor (Jiangyin) Corporation, Jiangyin, CN;

Inventors:

Yenheng Chen, Jiangyin, CN;

Chentar Wu, Jiangyin, CN;

Chengchung Lin, Jiangyin, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01Q 1/38 (2006.01); H01Q 21/06 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/3128 (2013.01); H01L 23/3731 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 24/32 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 21/061 (2013.01); H01Q 21/065 (2013.01); H01L 24/29 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/29083 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A semiconductor package structure having an antenna module includes: a substrate, having a first surface and a second surface; a semiconductor chip, disposed on the first surface; a plastic packaging material layer, formed on the first surface, where the plastic packaging material layer wraps the semiconductor chip and exposes a part of a front surface of the semiconductor chip; a rewiring layer, disposed on the plastic packaging material layer and electrically connected to the semiconductor chip; a metal bump, electrically connected to the rewiring layer; and an antenna module, disposed on the second surface of the substrate.


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