The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Aug. 11, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

James E. Davis, Meridian, ID (US);

Kevin G. Duesman, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 23/66 (2006.01); H01L 23/62 (2006.01); H01L 49/02 (2006.01); H01L 23/64 (2006.01); H01L 27/11578 (2017.01); H01L 27/11551 (2017.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01L 23/5283 (2013.01); H01L 23/53257 (2013.01); H01L 23/62 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 28/10 (2013.01); H01L 27/11551 (2013.01); H01L 27/11578 (2013.01);
Abstract

Semiconductor devices having inductive structures, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor device includes a substrate and at least one circuit component coupled to the substrate. The semiconductor device can further include an inductive structure carried by the substrate and having a stack of alternating first and second layers. In some embodiments, the first layers comprise an oxide material and the second layers each include a coil of conductive material. The coils of conductive material can be electrically coupled (a) together to form an inductor and (b) to the at least one circuit component.


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