The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Aug. 28, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Daniel H. Morris, San Francisco, CA (US);

Seiyon Kim, Portland, OR (US);

Uygar E. Avci, Portland, OR (US);

Ian A. Young, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/22 (2006.01); H01L 27/1159 (2017.01); H01L 29/78 (2006.01); H01L 21/28 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1159 (2013.01); G11C 11/221 (2013.01); G11C 11/223 (2013.01); G11C 11/2255 (2013.01); G11C 11/2257 (2013.01); H01L 29/40111 (2019.08); H01L 29/516 (2013.01); H01L 29/6684 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01); H01L 29/78391 (2014.09);
Abstract

Described herein are ferroelectric (FE) memory cells that include transistors having gates with FE capacitors integrated therein. An example memory cell includes a transistor having a semiconductor channel material, a gate dielectric over the semiconductor material, a first conductor material over the gate dielectric, a FE material over the first conductor material, and a second conductor material over the FE material. The first and second conductor materials form, respectively, first and second capacitor electrodes of a capacitor, where the first and second capacitor electrodes are separated by the FE material (hence, a 'FE capacitor'). Separating a FE material from a semiconductor channel material of a transistor with a layer of a gate dielectric and a layer of a first conductor material eliminates the FE-semiconductor interface that may cause endurance issues in some other FE memory cells.


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