The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Mar. 26, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventor:

Guangjun Yang, Meridian, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 49/02 (2006.01); G11C 5/02 (2006.01); G11C 5/10 (2006.01); G11C 11/402 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10805 (2013.01); G11C 5/025 (2013.01); G11C 5/10 (2013.01); G11C 11/4023 (2013.01); H01L 28/40 (2013.01);
Abstract

Some embodiments include an integrated assembly. The integrated assembly includes active regions which each have a digit-line-contact-region between a pair of capacitor-contact-regions. The capacitor-contact-regions are arranged in a pattern such that six adjacent capacitor-contact-regions form a substantially rectangular configuration. Conductive redistribution material is coupled with the capacitor-contact-regions and extends upwardly and laterally outwardly from the capacitor-contact-regions. Upper surfaces of the conductive redistribution material are arranged in a pattern such that seven adjacent of the upper surfaces form a unit of a substantially hexagonal-close-packed configuration. Capacitors are coupled with the upper surfaces of the conductive redistribution material.


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