The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Dec. 14, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co. Ltd., Hsinchu, TW;

Inventors:

Cheng-Yen Tsai, New Taipei, TW;

Ming-Chi Huang, Zhubei, TW;

Zoe Chen, Taipei, TW;

Wei-Chin Lee, Taipei, TW;

Cheng-Lung Hung, Hsinchu, TW;

Da-Yuan Lee, Jhubei, TW;

Weng Chang, Hsinchu, TW;

Ching-Hwanq Su, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 29/66 (2006.01); H01L 29/51 (2006.01); H01L 29/78 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/49 (2006.01); H01L 21/324 (2006.01); H01L 21/768 (2006.01); H01L 21/28 (2006.01); H01L 21/8238 (2006.01); H01L 21/02 (2006.01); H01L 21/321 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0924 (2013.01); H01L 21/0228 (2013.01); H01L 21/0271 (2013.01); H01L 21/02318 (2013.01); H01L 21/02321 (2013.01); H01L 21/28088 (2013.01); H01L 21/324 (2013.01); H01L 21/3212 (2013.01); H01L 21/76829 (2013.01); H01L 21/823821 (2013.01); H01L 21/823857 (2013.01); H01L 21/823864 (2013.01); H01L 21/823871 (2013.01); H01L 29/0847 (2013.01); H01L 29/1033 (2013.01); H01L 29/517 (2013.01); H01L 29/6681 (2013.01); H01L 29/66545 (2013.01); H01L 29/66553 (2013.01); H01L 29/7851 (2013.01); H01L 27/092 (2013.01); H01L 29/4966 (2013.01); H01L 29/513 (2013.01); H01L 29/7848 (2013.01);
Abstract

In an embodiment, a method includes: forming a gate dielectric layer on an interface layer; forming a doping layer on the gate dielectric layer, the doping layer including a dipole-inducing element; annealing the doping layer to drive the dipole-inducing element through the gate dielectric layer to a first side of the gate dielectric layer adjacent the interface layer; removing the doping layer; forming a sacrificial layer on the gate dielectric layer, a material of the sacrificial layer reacting with residual dipole-inducing elements at a second side of the gate dielectric layer adjacent the sacrificial layer; removing the sacrificial layer; forming a capping layer on the gate dielectric layer; and forming a gate electrode layer on the capping layer.


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