The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Sep. 16, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yonghyuk Choi, Suwon-si, KR;

Sangwan Nam, Hwaseong-si, KR;

Jaeduk Yu, Seoul, KR;

Sangwon Park, Seoul, KR;

Bongsoon Lim, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/10 (2006.01); G11C 29/00 (2006.01); G11C 29/44 (2006.01); G11C 29/18 (2006.01); G11C 7/10 (2006.01); G11C 29/12 (2006.01);
U.S. Cl.
CPC ...
G11C 29/76 (2013.01); G11C 7/1057 (2013.01); G11C 7/1084 (2013.01); G11C 29/18 (2013.01); G11C 29/44 (2013.01); G11C 2029/1202 (2013.01); G11C 2029/1802 (2013.01);
Abstract

A nonvolatile memory device includes memory cell region including a first metal pad and a peripheral circuit region including a second metal pad, is connected to the memory cell region by the first metal pad and the second metal pad and includes including an address decoder and a page buffer circuit located on a first substrate. A memory cell array is provided in the memory cell region, which includes a first vertical structure on a second substrate. The first vertical structure includes first sub-blocks and first via areas in which one or more through-hole vias are provided, and through-hole vias pass through the first vertical structure. A control circuit in the peripheral circuit region groups the memory blocks into a plurality of groups based on whether the memory blocks is close to the first via areas and performs address re-mapping.


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