The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

Oct. 08, 2020
Applicant:

Stratasys, Inc., Eden Prairie, MN (US);

Inventors:

Joel Ong, San Francisco, CA (US);

Christopher Prucha, San Francisco, CA (US);

Stephanie Benight, San Francisco, CA (US);

Bill Buel, San Francisco, CA (US);

Assignee:

Stratasys, Inc., Eden Prairie, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B29C 64/295 (2017.01); B29C 64/364 (2017.01); B29C 64/135 (2017.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01); B29C 64/255 (2017.01); B29C 64/124 (2017.01); B29C 64/232 (2017.01); B29C 64/129 (2017.01);
U.S. Cl.
CPC ...
B29C 64/364 (2017.08); B29C 64/124 (2017.08); B29C 64/129 (2017.08); B29C 64/135 (2017.08); B29C 64/232 (2017.08); B29C 64/255 (2017.08); B29C 64/295 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); G05B 2219/49013 (2013.01);
Abstract

A method for additive manufacturing includes: at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state; at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature; and, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature and to the interface layer exhibiting a second temperature proximal the target reaction temperature: at the resin interface, selectively photocuring a first volume of the resin to form a first layer of a build adhered to a build platform; and retracting the build platform away from the build window.


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