The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Sep. 24, 2020
Applicant:

Fujimi Incorporated, Kiyosu, JP;

Inventors:

Yukinobu Yoshizaki, Kiyosu, JP;

Ayano Yamazaki, Kiyosu, JP;

Assignee:

FUJIMI INCORPORATED, Kiyosu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H05K 3/26 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H05K 3/26 (2013.01); H05K 2203/0756 (2013.01);
Abstract

To provide a polishing composition suitable for the use of polishing a polishing object having a film containing a silicon material having a silicon-silicon bond formed on a pattern containing an insulating film by a CMP method to form circuit patterns containing the silicon material and capable of also suppressing a remarkable reduction in polishing removal rate. A polishing composition of this invention contains abrasives, a first water-soluble polymer containing a polymer compound containing a lactam ring and having a weight average molecular weight of less than 300,000, a second water-soluble polymer containing a polymer compound containing a lactam ring and having a weight average molecular weight smaller than that of the first water-soluble polymer, a basic compound, and water.


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