The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Mar. 29, 2019
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Hsin-Li Cheng, Hsinchu County, TW;
Yu-Chi Chang, Kaohsiung, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/45 (2006.01); H01L 29/78 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 21/762 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/456 (2013.01); H01L 21/76224 (2013.01); H01L 21/823481 (2013.01); H01L 29/401 (2013.01); H01L 29/66477 (2013.01); H01L 29/78 (2013.01);
Abstract
A semiconductor structure is disclosed. The semiconductor structure includes: a substrate; an active area including a channel region sandwiched between two source/drain regions; an insulation region surrounding the active area from a top view; and a dielectric layer disposed over and in contact with an interface between the insulation region and the source/drain regions. A method of manufacturing the same is also disclosed.