The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Jun. 30, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Vijay K. Nair, Mesa, AZ (US);

Digvijay A. Raorane, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/498 (2006.01); H01L 23/055 (2006.01); H01L 23/552 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 21/4817 (2013.01); H01L 23/055 (2013.01); H01L 23/3128 (2013.01); H01L 23/3675 (2013.01); H01L 23/49827 (2013.01); H01L 23/5384 (2013.01); H01L 23/552 (2013.01); H01L 25/0655 (2013.01);
Abstract

Enclosure technology for electronic components is disclosed. An enclosure for an electronic component can comprise a base member and a cover member disposed on the base member such that the cover member and the base member form an enclosure for an electronic component. In one aspect, the base member can have at least one via extending therethrough. The at least one via can be configured to electrically couple an enclosed electronic component with another electronic component external to the enclosure. In another aspect, the cover member can include a protrusion, a receptacle, or both, and the base member can include a mating protrusion, receptacle, or both to facilitate proper alignment of the cover member and the base member. Electronic device packages and associated systems and methods are also disclosed.


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