The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Jan. 23, 2013
Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Satoshi Takeda, Toyama, JP;

Makoto Nakajima, Toyama, JP;

Yuta Kanno, Toyama, JP;

Hiroyuki Wakayama, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/075 (2006.01); G03F 7/11 (2006.01); H01L 21/027 (2006.01); C09D 183/04 (2006.01); H01L 21/308 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0274 (2013.01); C09D 183/04 (2013.01); G03F 7/0752 (2013.01); G03F 7/11 (2013.01); H01L 21/3081 (2013.01); C08G 77/80 (2013.01);
Abstract

A resist underlayer film for a resist pattern formation by developing a resist with organic solvent after exposure of resist. Method for manufacturing a semiconductor includes: applying onto a substrate a resist underlayer film forming composition including hydrolyzable silanes, hydrolysis products of hydrolyzable silanes, hydrolysis-condensation products of hydrolyzable silanes, or a combination thereof. Hydrolyzable silanes being silane of Formulas (1), (2) and (3). Silane of Formulas (1), (2) and (3) in total silanes in a ratio % by mole of 45-90:6-20:0-35; baking the applied resist underlayer film forming composition to form a resist underlayer film; applying a composition to form a resist film; exposing the resist film to light; developing the resist film after exposure, with organic solvent to obtain patterned resist film; and etching the resist underlayer film by using the patterned resist film and processing the substrate using the patterned resist underlayer film; whereinSi(R)  Formula (1)R[Si(R)]  Formula (2)R[Si(R)]  Formula (3).


Find Patent Forward Citations

Loading…