The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Jan. 30, 2015
Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Makiko Umezaki, Toyama, JP;

Ryo Karasawa, Toyama, JP;

Shuhei Shigaki, Toyama, JP;

Ryuta Mizuochi, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 133/12 (2006.01); H01L 21/027 (2006.01); C08F 220/14 (2006.01); G03F 7/11 (2006.01); C08L 33/14 (2006.01); G03F 7/09 (2006.01); G03F 7/075 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01); C08L 101/04 (2006.01); C08L 101/00 (2006.01);
U.S. Cl.
CPC ...
C08F 220/14 (2013.01); C08L 33/14 (2013.01); C09D 133/12 (2013.01); G03F 7/0752 (2013.01); G03F 7/094 (2013.01); G03F 7/11 (2013.01); G03F 7/16 (2013.01); G03F 7/20 (2013.01); G03F 7/30 (2013.01); H01L 21/0276 (2013.01); C08L 101/00 (2013.01); C08L 101/04 (2013.01);
Abstract

A film with reduced formation of an edge reservoir at a periphery of a film in which the edge reservoir causes an unnecessary residue that cannot be removed by an etching process, and a method for forming the film. A film forming composition for use in a lithography process includes a surfactant containing a polymer and an oligomer having a Cperfluoroalkyl partial structure. The perfluoroalkyl partial structure may further include an alkyl partial structure. The surfactant is contained in an amount of 0.0001% by mass to 1.5% by mass based on the total solid content of the film forming composition. The film forming composition further includes a coating film resin, the coating film resin is a novolac resin, a condensation epoxy resin, a (meth)acylic resin, a polyether-based resin, or a silicon-containing resin, etc. The formed film can be used as a resist underlayer film or a resist overlayer film.


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