The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2022

Filed:

Jul. 01, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Georgios Dogiamis, Chandler, AZ (US);

Sasha Oster, Marion, IA (US);

Telesphor Kamgaing, Chandler, AZ (US);

Erich Ewy, Phoenix, AZ (US);

Adel Elsherbini, Chandler, AZ (US);

Johanna Swan, Scottsdale, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/16 (2006.01); H01P 5/02 (2006.01); B60R 16/023 (2006.01); H01L 23/66 (2006.01); H01L 25/18 (2006.01); H01R 13/622 (2006.01); H01R 13/631 (2006.01); H01R 13/646 (2011.01); H05K 1/18 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01P 5/02 (2013.01); B60R 16/0231 (2013.01); H01L 23/66 (2013.01); H01L 25/18 (2013.01); H01P 3/16 (2013.01); H01R 13/622 (2013.01); H01R 13/631 (2013.01); H01R 13/646 (2013.01); H05K 1/181 (2013.01); H05K 5/0017 (2013.01); H05K 5/0247 (2013.01); H01L 2223/6627 (2013.01); H05K 7/20872 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10734 (2013.01);
Abstract

Embodiments of the invention include dielectric waveguides and connectors for dielectric waveguides. In an embodiment a dielectric waveguide connector may include an outer ring and one or more posts extending from the outer ring towards the center of the outer ring. In some embodiments, a first dielectric waveguide secured within the dielectric ring by the one or more posts. In another embodiment, an enclosure surrounding electronic components may include an enclosure wall having an interior surface and an exterior surface and a dielectric waveguide embedded within the enclosure wall. In an embodiment, a first end of the dielectric waveguide is substantially coplanar with the interior surface of the enclosure wall and a second end of the dielectric waveguide is substantially coplanar with the exterior surface of the enclosure wall.


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